View BV1LB085FJ-CE2_8877652.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

product structure: silicon monolithic integrated circuit ? this product is not designed to protect it from radiation. 1/17 datashee t ? 2016 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 14 ? 001 tsz02201-0g3g0bd00090-1-2 17.mar.2016 rev.001 automotive ipd series 1ch low side switch ic bv1lb085fj-c features built-in overcurrent limiting circuit(ocp) built-in thermal shutdown circuit(tsd) built-in active clamp circuit direct control enabled from cmos logic ic, etc. low on resistance r on =85m ? (typ) (when v in ? 5v, i d =0.5a, tj ? 25 ? c) monolithic power management ic with the control block (cmos) and power mos fet mounted on a single chip aec-q100 qualified (note 1) (note 1) grade1 general description the bv1lb085fj-c is an automotive 1ch low side switch ic, which has built-in overcurrent limiting circuit, thermal shutdown circuit, and overvoltage (active clamp) protection circuit. product summary package w(typ) x d(typ) x h(max) sop-j8 4.90mm x 6.00mm x 1.65mm applications 1ch low side switch for driving resist ive, inductive load, capacitive load block diagram on-state resistance (t j =25c, typ) 85m ? overcurrent limit (t j =25c, typ) 17.5a output clamp voltage (min) 42v active clamp energy (t j =25c) 260mj
2/17 datasheet d a t a s h e e t bv1lb085fj-c ? 2016 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 tsz02201-0g3g0bd00090-1-2 17.mar.2016 rev.001 pin configurations pin descriptions (note 1) input pin is used to in ternally connect a pull-down resistor. difinition figure 1. difinition pin no. symbol function 1 source gnd pin 2 source gnd pin 3 source gnd pin 4 in input pin (note 1) 5 drain output pin 6 drain output pin 7 drain output pin 8 drain output pin source source source in drain drain drain drain 1 2 3 4 8 7 6 5 bv1lb085fj sop-j8 (top view)
3/17 datasheet d a t a s h e e t bv1lb085fj-c ? 2016 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 tsz02201-0g3g0bd00090-1-2 17.mar.2016 rev.001 absolute maximum ratings (t j =25c) parameter symbol ratings unit drain-source voltage in output block v ds -0.3 to +42 (note 1) v input voltage v in -0.3 to +7 v output current (dc) i d 13 (note 2) a active clamp energy (single pulse) t j(start) = 25c (note 3) e as(25c) 260 mj active clamp energy (single pulse) t j(start) = 150c (note 3) (note 4) e as(150c) 105 operating temperature range t j -40 to +150 c storage temperature range t stg -55 to +150 c maximum junction temperature t jmax 150 c (note 1) please refer to p.16 ?operation no tes?, when is used at less than -0.3v. (note 2) internally limited by the overcurrent limiting circuit. (note 3) maximum active clamp energy, using single non-repetitive pulse of 1.5a, v b = 16v. (note 4) not 100% tested.
4/17 datasheet d a t a s h e e t bv1lb085fj-c ? 2016 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 tsz02201-0g3g0bd00090-1-2 17.mar.2016 rev.001 thermal characteristics (note 1) parameter symbol ratings unit conditions sop-j8 thermal resistance between channel and ambient temperature ja 143.7 c / w 1s (note 2) 86.9 c / w 2s (note 3) 67.5 c / w 2s2p (note 4) (note 1) the thermal impedance is base d on jesd51 - 2a (still - air) standard. it is used the chip of bv1lb085fj-c. (note 2) jesd51 - 3 compliance fr4 114.3 mm 76.2 mm 1.57 mm 1 layer (1s) (top layer copper rohm recommend land pattern + measurem ent wiring, copper thickness 2oz) (note 3) jesd51 -5 compliance fr4 114. 3 mm 76.2 mm 1.60 mm 2 layer (2s) (top layer copper rohm recommend land partten + measurem ent wiring, bottom layer copper area 74.2 mm 74.2 mm copper thickness (top and bottom layer) 2 oz) (note 4) jesd51 -5 / -7 compliance fr4 114.3 mm 76.2 mm 1.60 mm 4 layer (2s2p) (top layer copper rohm recommend land pattern + measurement wiring / 2 layer, 3 layer, bottom layer copper area: 74.2 mm 74.2 mm, copper thickness (top and bottom layer / inner layer) 2 oz / 1oz) pcb layout 1s (1 layer) footprint only figure 2. pcb layout 1s (1 layer) dimension value board finish thickness 1.57 mm 10% board dimension 76.2 mm x 114.3 mm board material fr4 copper thickness (top/bottom layers) 0.070mm (cu:2oz)
5/17 datasheet d a t a s h e e t bv1lb085fj-c ? 2016 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 tsz02201-0g3g0bd00090-1-2 17.mar.2016 rev.001 pcb layout 2s2p (2layer) top layer bottom layer cross section top layer bottom layer figure 3. pcb layout 2s dimension value board finish thickness 1.60 mm 10% board dimension 76.2 mm x 114.3 mm board material fr4 copper thickness (top/bottom layers) 0.070mm (cu + plating) pcb layout 2s2p (4layer) top layer 2 nd layer 3 rd layer bottom layer cross section top layer 2 nd /3 rd /bottom layer figure 4. pcb layout 2s2p (4 layer) dimension value board finish thickness 1.60 mm 10% board dimension 76.2 mm x 114.3 mm board material fr4 copper thickness (top/bottom layers) 0.070mm (cu + plating) copper thickness (inner layers) 0.035mm
6/17 datasheet d a t a s h e e t bv1lb085fj-c ? 2016 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 tsz02201-0g3g0bd00090-1-2 17.mar.2016 rev.001 over thermal resistance (single pulse) figure 5. over thermal resistance
7/17 datasheet d a t a s h e e t bv1lb085fj-c ? 2016 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 tsz02201-0g3g0bd00090-1-2 17.mar.2016 rev.001 electrical characteristics (unless otherwise specified, ? 40 ? c ? t j ? ? 150 ? c and v in ? 3.0v to 5.5v) parameter symbol limit unit conditions min typ max output clamp voltage v cl 42 48 54 v v in =0v, i d =1ma on-state resistance1 (at 25 c) r on1 - 85 120 m ? v in =5v, i d =0.5a,tj=25c on-state resistance1 (at 150 c) r on1 - 155 210 m ? v in =5v, i d =0.5a,tj=150c on-state resistance2 (at 25 c) r on2 - 115 150 m ? v in =3v, i d =0.5a, tj=25c on-state resistance2 (at 150 c) r on2 - 195 260 m ? v in =3v, i d =0.5a,tj=150c leak current (at 25 c) v il1 - 0 6.5 a v in =0v, v ds =18v,tj=25c leak current (at 150 c) v il2 - 5 40 a v in =0v, v ds =18v,tj=150c turn-on time on - - 100 s v in =0v/5v, r l =15 ? , v b =12v, tj=25c turn-off time off - - 100 s v in =0v/5v, r l =15 ? , v b =12v, tj=25c slew rate on sr on - 0.5 1.0 v/ s v in =0v/5v, r l =15 ? , v b =12v, tj=25c slew rate off sr off - 1.0 2.0 v/ s v in =0v/5v, r l =15 ? , v b =12v, tj=25c input threshold voltage v th 1.1 - 2.7 v i d =1ma high-level input current1 (in normal operation) i inh1 - 150 300 a v in =5v high-level input current2 (in abnormal operation) i inh2 - 300 500 a v in =5v low-level input current i inl -10 0 10 a v in =0v overcurrent detection current i ocp 13.0 17.5 22.0 a v in =5v, tj=25c tsd detection temperature (note 1) t jd 150 175 - c v in =5v tsd release temperature (note 1) t jr 130 - - c v in =5v tsd hysteresis (note 1) S t jd - 15 - c v in =5v (note 1) not 100% tested.
8/17 datasheet d a t a s h e e t bv1lb085fj-c ? 2016 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 tsz02201-0g3g0bd00090-1-2 17.mar.2016 rev.001 measuring circuit figure 8. t on ? t off measuring circuit i/o pin truth table operating status input signal output level output status normal h l on l h off overcurrent h h current limiting l h off overheating h h off l h off figure 6. output clamp voltage measuring circuit figure 7. on-state resistance measuring circuit drain in source r on = v ds / i d i d = 0 . 5 a v v in drain in source v b = 12v r l = 15 v in = 0v/ 5 v v
9/17 datasheet d a t a s h e e t bv1lb085fj-c ? 2016 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 tsz02201-0g3g0bd00090-1-2 17.mar.2016 rev.001 typical performance curves (unless othe rwise specified, tj=25c, vin=5.0v) figure 10. on-state resistance characteristics (input voltage characteristics) figure 12. leak current vs. junction temperature figure 9. out clamp voltage vs. junction temperature figure 11. on-state resistance characteristics (temperature characteristics) 0 20 40 60 80 100 120 140 160 01234567 input voltage v in [v] drain-source on resistance[m ? ] 0 20 40 60 80 100 120 140 160 -40 -10 20 50 80 110 140 170 channel temperature tj [ ] drain-source on resistance[m ? ] 0 2 4 6 8 10 12 14 -40 -10 20 50 80 110 140 170 ileak current [ua] channel temperature tj [] 0 10 20 30 40 50 60 70 -40 -10 20 50 80 110 140 170 vclamp voltage [v] channel temperature tj []
10/17 datasheet d a t a s h e e t bv1lb085fj-c ? 2016 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 tsz02201-0g3g0bd00090-1-2 17.mar.2016 rev.001 typical performance curves (unless otherwise specified, tj=25c, vin=5.0v) - continued figure 14. turn-on / turn-off time vs. junction temperature figure 16. input current characteristics (input voltage characteristics) figure 13. turn-on / turn-off time characteristics (input voltage characteristics) figure 15. input threshold voltage characteristics (temperature characteristics) 0 25 50 75 100 125 150 175 01234567 input voltage vin[v] turn-on/turn-off time [ ] t on t off 0 10 20 30 40 50 60 70 -40 -10 20 50 80 110 140 170 channel temperature tj [ ] turn-on/turn-off time[ ] t off t on 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 -40 -10 20 50 80 110 140 170 channel temperature tj [v] input threshold voltage [v] 0 50 100 150 200 250 01234567 input voltage v in [v] input current i in [a]
11/17 datasheet d a t a s h e e t bv1lb085fj-c ? 2016 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 tsz02201-0g3g0bd00090-1-2 17.mar.2016 rev.001 typical performance curves (unless otherwise specified, tj=25c, vin=5.0v) - continued figure 18. overcurrent detection current characteristics (input voltage characteristics) figure 17. figure 17. input current characteristics (temperature characteristics) 0 50 100 150 200 250 -40 -10 20 50 80 110 140 170 channel temperature tj [ ] input current iin [a] 0 5 10 15 20 25 0123456 output voltage v ds [v] overcurrent protection current [a] 0 5 10 15 20 25 -40 -10 20 50 80 110 140 170 channel temperature tj [ ] overcurrent protection current [a] figure 19. overcurrent detection current characteristics (temperature characteristics) vin=7v 6v 5v 4v 3v
12/17 datasheet d a t a s h e e t bv1lb085fj-c ? 2016 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 tsz02201-0g3g0bd00090-1-2 17.mar.2016 rev.001 in drain normal operation tsd normal operation normal operatio n over current 0 12 10 5 0 10 10 90 90 sr off sr on t on t off in wave form drain wave form 90 90 10 t r 0.1us t f 0.1us timing chart figure 20. operation sequence input voltage v in t t t output voltage v ds output voltage i d v cl figure 22. switching time figure 21. inductive load operation
13/17 datasheet d a t a s h e e t bv1lb085fj-c ? 2016 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 tsz02201-0g3g0bd00090-1-2 17.mar.2016 rev.001 ordering information bv1lb085fj - ce2 package fj sop-j8 packaging and forming specification e2 embossed tape and reel (sop-j8) c automotive product marking diagram sop-j8 (top view) 1lb85 part number marking lot number 1pin mark
14/17 datasheet d a t a s h e e t bv1lb085fj-c ? 2016 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 tsz02201-0g3g0bd00090-1-2 17.mar.2016 rev.001 physical dimension, tape and reel information package name sop-j8 the direction is the 1pin of product is at the upper left when you hold reel on the left hand and pull out the tape on the right hand reel 1pin order quantity need to be multiple of minimum quantity.
15/17 datasheet d a t a s h e e t bv1lb085fj-c ? 2016 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 tsz02201-0g3g0bd00090-1-2 17.mar.2016 rev.001 operational notes 1. grounding interconnection pattern when a small-signal ground and a high-current ground are us ed, it is recommended to isolate the high-current grounding interconnection pattern and the small-signal grounding interconnection pattern and establish a single ground at the reference point of a set so that voltage changes due to the resistance and high current of patterned interconnects will not cause any changes in the small-signal ground voltage. pay careful attention to prevent changes in the interconnection pattern of ground for external components. the ground lines must be as short and thick as possible to reduce line impedance. 2. thermal design should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 3. absolute maximum ratings operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal ci rcuitry. therefore, it is im portant to consider circuit protection measures, such as adding a fuse, in case t he ic is operated over the absolute maximum ratings. 4. inspections on set board if a capacitor is connected to a low-impedance pin in order to conduct inspections of the ic on a set board, stress may apply to the ic. to avoid that, be sure to discharge the capa citor in each process. in addition, to connect or disconnect the ic to or from a jig in the testing process, be sure to turn off the power supply prior to connecting the ic, and disconnect it from the jig only after turning off the power s upply. furthermore, in order to protect the ic from static electricity, establish a ground for the ic assembly proce ss and pay utmost attention to transport and store the ic. 5. inter-pin short and mounting errors ensure that the direction and position are correct when mount ing the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 6. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 7. thermal shutdown circuit ic has a built-in thermal shutdown circuit as an overheat-p rotection measure. the circuit is designed to turn off output when the temperature of the ic chip exceeds 175 ? c (typ) and return the ic to the normal operation when the temperature falls below 150 ? c (typ). the thermal shutdown circuit is a circuit absolutely intended to protect the ic from the rmal runaway, not intended to protect or guarantee the ic. consequently , do not operate the ic based on the s ubsequent continuous use or operation of the circuit. 8. overcurrent limiting circuit ic incorporates an integrated overcurrent protection circuit t hat is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operat ion or transitioning of the protection circuit. 9. overvoltage (active clamp) protection function ic has a built-in overvoltage protection function in order for the ic to absorb counter-electromotive force energy gener- ated when inductive load is turned off. since the input vo ltage is clamped at 0v. when the active clamp circuit is activated, the thermal shutdown circuit is disabled. design a thermal solution so that the chip temperature will definitely come to less than 150 ? c. 10. reverse connection of power supply the reverse connection of the power supply connector may caus e this ic to break down. in order to avoid the reverse connection breakdown, mount an external diode between the powe r supply and the power supply pin of the ic, or take other protection measures.
16/17 datasheet d a t a s h e e t bv1lb085fj-c ? 2016 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 tsz02201-0g3g0bd00090-1-2 17.mar.2016 rev.001 n+sub n-epi n+ drain source in n+ n+ p n+ n+ n+ p+ p 330 ? mcu n+sub n-epi n+ drain source in n+ n+ p n+ n+ n+ p+ p 330 ? mcu operational notes ? continued 11. negative current of output when supply a negative current from drain terminal in the stat e that supplied the voltage to in terminal. the current pass from in terminal to drain terminal through a parasitic transistor and voltage of in terminal descend as shown in figure.23 and figure.24. as shown in figure.23 power mos is turned on, set the drai n terminal is more than -0.3v. because a negative current may be passed to drain terminal from a power supply of the connection of the in terminal (mcu, and so on). as shown in figure.24 power mos is turned off, add a restriction resistance higher than 330 ? to in terminal. because a negative current may be passed to drain terminal from gnd of the connection of the in terminal. the restriction resistance value, set up in consideration of the voltage descent caused by the in terminal current. figure 23. negative current pass (when power mos is turned on) figure 24. negative current pass (when power mos is turned off)
17/17 datasheet d a t a s h e e t bv1lb085fj-c ? 2016 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 tsz02201-0g3g0bd00090-1-2 17.mar.2016 rev.001 revision history date revision changes 17.mar.2016 001 new release
notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. ( n ote1) m edical equipment classifica tion of the specific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a cert ain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the f ollowing are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any specia l or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, prior to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our products in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cle aning residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proof design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation o f performance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under de viant condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products, please consult with th e rohm representative in advance. for details , please refer to rohm mounting specification
notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin con sidering variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contain ed in this document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contain ed in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive pr oduct, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condi tion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connecti ons may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are e xposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaut ion for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all informa tion and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third pa rty regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or impli ed, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert its intellectual property rig hts or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the pr oducts may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated com panies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bv1lb085fj-c package sop-j8 unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes bv1lb085fj-c - web page

▲Up To Search▲

Price & Availability of BV1LB085FJ-CE2

	To Download BV1LB085FJ-CE2 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .